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HD74HC670
4-by-4 Register File (with 3-state outputs)
Description
The HD74HC670, 16-bit register file is organized as 4 words of 4 bits each and separate on-chip decoding is provided for addressing the four word locations to either write-in or retrieve data. This permits simultaneous writing into one location and reading from another word location. Four data inputs are available which are used to supply the 4-bit word to be stored. Location of the word is determined by the write-address inputs A and B in conjunction with a write-enable signal. Data applied at the inputs should be in its true form. That is, if a high-level signal is desired from the output, a high-level is applied at the data input for that particular bit location. The latch inputs are arranged so that new data will be accepted only if both internal address gate inputs are high. When this condition exists, data at the D input is transferred to the latch output. When the write-enable input, (G W ) is high, the data inputs are inhibited and their levels can cuase no change in the information stored in the internal latches. When the read-enable input, (GR) is high, the data outputs are inhibited and go into the high-impedance state. The individual address lines permit direct acquisition of data stored in any four of the latches. Four individual decoding gates are used to complete the address for reading a word. when the read address is made in conjunction with the read-enable signal, the word appears at the four outputs.
Features
* * * * * High Speed Operation: tpd (Read Select to Q) = 21 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C)
HD74HC670
Function Table
Write Inputs WB L L H H X WA L H L H X GW L L L L H Word 0 Q=D Q0 Q0 Q0 Q0 1 Q0 Q=D Q0 Q0 Q0 2 Q0 Q0 Q=D Q0 Q0 3 Q0 Q0 Q0 Q=D Q0
Read Inputs RB L L H H X RA L H L H X GR L L L L H
Outputs Q1 W0 B 1 W1 B 1 W2 B 1 W3 B 1 Z Q2 W0 B 2 W1 B 2 W2 B 2 W3 B 2 Z Q3 W0 B 3 W1 B 3 W2 B 3 W3 B 3 Z Q4 W0 B 4 W1 B 4 W2 B 4 W3 B 4 Z
H : high level L : low level X : irrelevant Z : high impedance (off) (Q = D) : The four selected internal flip-flop outputs will assume the states applied to the four external data inputs. Q0 : The level of Q before the indicated input conditions were established. W0 B 1 : The first bit of word 0, etc.
2
HD74HC670
Pin Arrangement
D2 Data D3 D4 RB RA Q4 Outputs Q3 GND
1 2 3 4 5 6 7 8 D3 D4 RB RA Q4 Q3 Q2 D2 D1 WA WB CW CR Q1
16 15 14 13 12 11 10 9
VCC Data D1 WA WB Write Enable Read Q1 Outputs Q2 Write select
Read select
(Top view)
Logic Diagram
To other three bits
D G D G D G D G Q Data Q Q Q Q VCC
WA
RA
WB
GR
GW
RB
3
HD74HC670
DC Characteristics
Ta = 25C Item Input voltage Symbol VIH Ta = -40 to +85C Max -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 5.0 1.0 40 A A A I OL = 6 mA I OL = 7.8 mA Vin = VIN or VIL, Vout = VCC or GND Vin = VCC or GND Vin = VCC or GND, Iout = 0 A V I OH = -6 mA I OH = -7.8 mA Vin = VIH or VIL I OL = 20 A V Vin = VIH or VIL I OH = -20 A V Unit V Test Conditions
VCC (V) Min Typ Max Min 2.0 4.5 6.0 1.5 -- 3.15 -- 4.2 -- -- -- -- -- -- -- -- -- -- 0.5 1.5 3.15 4.2 --
VIL
2.0 4.5 6.0
1.35 -- 1.8 -- 1.9 4.4 5.9 4.13 5.63 -- -- --
Output voltage
VOH
2.0 4.5 6.0 4.5 6.0
1.9 2.0 -- 4.4 4.5 -- 5.9 6.0 -- 4.18 -- 5.68 -- -- -- -- -- -- -- -- -- -- --
VOL
2.0 4.5 6.0 4.5 6.0
0.0 0.1 0.0 0.1 0.0 0.1 -- -- -- -- --
0.26 -- 0.26 -- 0.5 -- 0.1 -- 4.0 --
Off-state output current Input current Quiescent supply current
I OZ Iin I CC
6.0 6.0 6.0
4
HD74HC670
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25C Item Symbol Ta = -40 to +85C Max 200 40 34 250 50 43 190 38 33 190 38 33 190 38 33 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- ns Write enable to Write select ns Write enable to Data ns Write select to Write enable ns Data to Write enable ns ns ns ns Data to Q ns Write enable to Q Unit ns Test Conditions Read select to Q
VCC (V) Min Typ Max Min 2.0 4.5 6.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 80 16 14 60 12 10 60 12 10 50 10 9 50 10 9 -- 21 -- -- 24 -- -- 18 -- -- 18 -- -- 17 -- -- -- -- -- 4 -- -- -- -- -- 6 -- -- -- -- 160 -- 32 27 -- --
Propagation delay t PLH time t PHL
t PLH t PHL
2.0 4.5 6.0
200 -- 40 34 -- --
t PLH t PHL
2.0 4.5 6.0
150 -- 30 26 -- --
Output enable time
t ZH t ZL
2.0 4.5 6.0
150 -- 30 26 -- --
Output disable time
t HZ t LZ
2.0 4.5 6.0
150 -- 30 26 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 100 20 17 75 15 13 75 15 13 63 13 11 63 13 11
Pulse width
tw
2.0 4.5 6.0
Setup time
t su
2.0 4.5 6.0
t su
2.0 4.5 6.0
Hold time
th
2.0 4.5 6.0 2.0 4.5 6.0
5
HD74HC670
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) (cont)
Ta = 25C Item Symbol Ta = -40 to +85C Max -- -- -- 95 19 16 10 pF ns Unit ns Test Conditions
VCC (V) Min Typ Max Min 2.5 4.5 6.0 100 -- 20 17 -- -- -- -- -- -- -- 5 -- 5 -- -- -- 75 15 13 10 125 25 21 -- -- -- --
Latch time for new t latch data
Output rise/fall time
t TLH t THL
2.0 4.5 6.0
Input capacitance
Cin
--
6
19.20 20.00 Max 16 9 7.40 Max 6.30
Unit: mm
1 1.3
1.11 Max
8
0.51 Min
2.54 Min 5.06 Max
7.62
2.54 0.25
0.48 0.10
0.25 - 0.05 0 - 15
Hitachi Code JEDEC EIAJ Weight (reference value)
+ 0.13
DP-16 Conforms Conforms 1.07 g
Unit: mm
10.06 10.5 Max 16 9
5.5
1
*0.22 0.05 0.20 0.04
8 0.80 Max
2.20 Max
0.20 7.80 + 0.30 -
1.15 0 - 8 0.70 0.20
1.27 *0.42 0.08 0.40 0.06
0.12 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA -- Conforms 0.24 g
*Dimension including the plating thickness Base material dimension
0.10 0.10
0.15
Unit: mm
9.9 10.3 Max 16 9 3.95 1 1.27 0.635 Max 8
0.11 0.14 + 0.04 - 1.75 Max
*0.22 0.03 0.20 0.03
0.10 6.10 + 0.30 -
1.08 0 - 8
0.67 0.60 + 0.20 -
*0.42 0.08 0.40 0.06
0.15 0.25 M
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-16DN Conforms Conforms 0.15 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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